TSMC added another $100 billion to its US investment, bringing the total to $265 billion. The money funds at least four more Arizona fabs at the 2nm node and below, plus more advanced packaging capacity. For scale, one 2nm-class fab module (about 20,000 wafer starts/month) costs $25–35 billion to build so this covers roughly four of them Arizona’s first fab is already producing chips for Apple and Nvidia and the second fab’s construction is done, with equipment installation starting Q3 2026 Also, CoWoS capacity has been a problem for AI accelerator production, so onshoring it means US customers could eventually get chips manufactured and packaged domestically CEO CC Wei gave no fixed timeline, saying pace depends on demand submitted by /u/ocean_protocol
Originally posted by u/ocean_protocol on r/ArtificialInteligence